Disadvantage of Internal Chip ESD Protection

Relying upon on-chip protection to suppress ESD/EOS events may provide a false sense of security if not carefully evaluated. In the past, 2kV-4kV of internal chip ESD protection was thought to be adequate protection. New standards such as IEC 61000-4-2 have raised the minimum protection level to as much as 15kV. As device geometries continue to shrink, it is becoming more difficult to add on-chip ESD protection with a common manufacturing process. As a result, devices operating at low voltages may not be adequately protected.

The application note linked below discusses the disadvantages of on-chip protection and provides the designer with applications information for adding external protection components to insure maximum ESD/EOS immunity.

Download our "Disadvantage of On-chip Transient Protection" application note

View our product selector to compare and select parts for your off-chip ESD protection application.