Pb(Lead)-Free/RoHS-Green Results

4 results found for "SX8654"
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Part Number / Package Info Product Information Product Status Compliance Status RoHS Compliance Status by Exemption Green Reportable Substances 9 Device Mass (mg) Whisker Testing 10 Automotive 11   Reports
Semtech Base
Part Number 1
Semtech Lead-
Free Part
Number 1A, 13
Part Description Package Type # of
Leads
Pb-Free 2 Reflow
Temperature °C 3
Lead or Ball
Finish
MSL Rating End of Life 6
Reference
LTB 6 REACH SVHC (169)
EC 1907/2006
JIG 101 12
A & B
RoHS / RoHS 2
2011/65/EC
RoHS 2/3 Amend
2015/863*
WEEE
2012/19/EU
China RoHS 2
GB/T 26572- 2011
Halogen
Free / Low
Proposition 65 Packaging Material 17
94/62/EC
RoHS 8
Compliant by
Exemption
1
Exp.
9/20/2015
2(a)
Exp.
9/20/2015
2(b)
Exp.
9/20/2015
2(c)
Exp.
12/31/2011
3
Exp.
9/20/2015
4
Exp.
9/20/2015
5
Exp.
TBD
6(a)*
Exp.
2016-2024
6(b)*
Exp.
2016-2024
6(c)*
Exp.
2016-2024
7(a)*
Exp.
2016-2024
7(b)*
Exp.
2016-2024
7(c)
Exp.
9/20/2015
8
Exp.
9/20/2015
9
Exp.
2016-2024
10(a)
Exp.
7/1/2008
10(b)
Exp.
TBD
11
Exp.
TBD
12
Exp.
TBD
13(a)*
Exp.
2016-2024
13(b)
Exp.
2016-2024
14
Exp.
1/1/2011
15*
Exp.
2016-2024
Antimony Sb / Beryllium Be Thermal Cycling Whisker Test
(-40°C to +85°C / 4000 cycles)
(YES/NO)
Ambient Temperature Storage, Whisker Test
(50°C, 4000Hrs)
(YES / NO)
60°C/90%RH 4000 Hrs, Whisker Test
(YES/NO)
AEC Q100 14

Qualified
Grade PPAP 15

Ready
IMDS 16

Posted
IPC 1752-2 SGS
Phosphorus P & Red P
Compliant Compliant Compliant Compliant Compliant Compliant Compliant Compliant Compliant Compliant (ND4) or PPM 7 Bonding Wire Die Attach Lead Frame Mold Compound Silicon Chip
SX8654 SX8654ICSTRT HAPTICS ENABLED 4/5-WIRE RESISTIVE TOUCHSCREEN CONTROLLER WITH PROXIMITY SENSING WLCSP 19 YES 260 - 3 EOL-000145 JULY 2017 YES YES YES YES YES YES YES YES YES NO - - - - - - - - - - - - - - - - - - - - - - - ND4 REFER TO IPC 1752-2 YES YES YES N/A N/A N/A N/A   BondingWire_TANAKA_Au_SGS.pdf DieAttach_Henkel_QMI519_SGS.pdf   MoldingCompound_SUMITOMO_EME-G770HC_SGS.pdf SiliconChip_United Microelectronics Corp_UMC WAFER_SGS.pdf
SX8654 SX8654IWLTRT HAPTICS ENABLED 4/5-WIRE RESISTIVE TOUCHSCREEN CONTROLLER WITH PROXIMITY SENSING MLPQ-W 20 YES 260 MATTE Sn 3 EOL-000145 JULY 2017 YES YES YES YES YES YES YES YES YES NO - - - - - - - - - - - - - - - - - - - - - - - ND4 REFER TO IPC 1752-2 YES YES YES N/A N/A N/A N/A IPC1752-2_SX8654IWLTRT_MLPQ-W.pdf BondingWire_TANAKA_Au_SGS.pdf DieAttach_Henkel_QMI519_SGS.pdf   MoldingCompound_SUMITOMO_EME-G770HC_SGS.pdf SiliconChip_United Microelectronics Corp_UMC WAFER_SGS.pdf
SX8654 SX8654ICS HAPTICS ENABLED 4/5-WIRE RESISTIVE TOUCHSCREEN CONTROLLER WITH PROXIMITY SENSING WLCSP 19 YES 260 SnAgCu 3 EOL-000145 JULY 2017 YES YES YES YES YES YES YES YES YES NO - - - - - - - - - - - - - - - - - - - - - - - ND4 REFER TO IPC 1752-2 YES YES YES N/A N/A N/A N/A   BondingWire_TANAKA_Au_SGS.pdf DieAttach_Henkel_QMI519_SGS.pdf   MoldingCompound_SUMITOMO_EME-G770HC_SGS.pdf SiliconChip_United Microelectronics Corp_UMC WAFER_SGS.pdf
SX8654 SX8654IWL HAPTICS ENABLED 4/5-WIRE RESISTIVE TOUCHSCREEN CONTROLLER WITH PROXIMITY SENSING MLPQ-W 20 YES 260 Au 3 EOL-000145 JULY 2017 YES YES YES YES YES YES YES YES YES NO - - - - - - - - - - - - - - - - - - - - - - - ND4 REFER TO IPC 1752-2 N/A N/A N/A N/A N/A N/A N/A   BondingWire_TANAKA_Au_SGS.pdf DieAttach_Henkel_QMI519_SGS.pdf   MoldingCompound_SUMITOMO_EME-G770HC_SGS.pdf SiliconChip_United Microelectronics Corp_UMC WAFER_SGS.pdf

 

Note (1)

A Pb-Free version of Semtech’s base part number may be available under a new part number.

Semtech’s Pb-free parts are designated with a unique suffix. Devices with part number suffix ending in “T” or “LF” are Pb-free. Using Semtech’s base part number nomenclature you may locate the Pb-Free part number and information on the Pb-Free version of the device. To learn more, contact your Semtech sales rep.

Note: Do to size limitations of many of Semtech product packaging there is no Pb-free designator marked on the part itself [top]

Note (1A)

When placing orders for Pb-Free devices use the Part Number listed in the Semtech Lead-Free Part Number column. [top]

Note (2)

Pb-Free: Semtech Corporation defines "Pb-Free" to mean semiconductor products meet the requirement that lead content not exceed 0.1% by weight in homogeneous materials unless exempt. [top]

Note (3)

Reflow information can be obtained by accessing Semtech's Reliability IR Reflow Profile http://www.semtech.com/quality/ir_reflow_profiles.html Some information is available within the attached IPC 1752-2 declaration. [top]

Note (4) (5)

PPM and or weight content is below level indicated in European Union's Restriction on Use of Hazardous Substances Directive, 2011/65/EC [top]

Note (6)

End of Life and Last Time Buy are listed as reference only. The EOL notificaiton process is governed by JEDEC 48, customer requirements, agreements, or by contract. Consult your Semech sales contact for more information. [top]

Note (7)

PPM calculations are at the homogeneous material level. [top]

Note (8)

RoHS compliance through exemption. Listing identified only key exemptions. Consult your Semtech sales rep. if additional information is needed.

1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.

2a. Mercury in straight fluorescent lamps for general purposes not exceeding 10 mg in halophosphate lamps.

2b. Mercury in straight fluorescent lamps for general purposes not exceeding 5 mg in triphosphate lamps with a normal life.

2c. Mercury in straight fluorescent lamps for general purposes not exceeding 8 mg in triphosphate lamps with long lifetime.

3. Mercury in straight fluorescent lamps for special purposes.

4. Mercury in other lamps not specifically mentioned in this list.

5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.

6a. Lead as an alloying element in steel containing up to 0.35% lead by weight.

6b. Lead as an alloying element in aluminum containing up to 0.4% lead by weight.

6c. Lead as an alloying element in copper containing up to 4% lead by weight.

7a. Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).

7b. Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications.

7c. Lead in electronic ceramic parts (e.g. piezoelectronic devices).

8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations.

9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.

10a. Deca BDE in polymeric applications.

10b. Lead in lead-bronze bearing shells.

11. Lead used in compliant pin connector systems.

12. Lead as a coating material for a thermal conduction module c-ring.

13a. Lead in optical and filter glass.

13b. Cadmium in optical and filter glass.

14. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight.

15. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages. [top]

Note (9)

Green Compatible: Semtech Corporation defines "Green Compatible" or "Green Reportable Substances" to mean free of Bromine (Br) and Antimony (Sb) based flame retardants not to exceed 0.1% by weight in homogeneous materials. [top]

Note (10)

Whisker testing performed in accordance with JEDEC 201, Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes [top]

Note (11)

Product identified and qualified for automotive application(s). Product qualified and tested to AEC Q100. Temperature grade is noted below:

· AEC-Q100 has following Automotive Grades;

Grade 0 (or A): -40°C to +150°C ambient operating temperature range

Grade 1 (or Q): -40°C to +125°C ambient operating temperature range

Grade 2 (or T): -40°C to +105°C ambient operating temperature range

Grade 3 (or I): -40°C to +85°C ambient operating temperature range

Grade 4 (or C): -40°C to +70°C ambient operating temperature range

Typically Commercial product would align with Grade 3 and Industrial product would align with Grade 2 and Grade 0 and 1 align with automotive.

More specifically with the automotive grades Grade 0 is usually used under the hood (due to harsher ambient conditions) whereas Grade 1 is used elsewhere in the vehicle (in the cab).

Refer to the product data sheet for aumotive application, AEC qualification and grade information. [top]

Note (12)

This declaration is in alignment with the Joint Industry Guide: Material Composition Declaration for Electronic Products (JIG-101) as it applies to Level A & Level B Materials and Substances. [top]

Note (13)

For Semtech Corporation's product material information, as it applies to our packing materials unsed in shipping "Pb-Free", "Green Compatible", or "RoHS Compliant" product refer to our Product Packaging Declaration within this website, www.semtech.com [top]

Note (14)

Semtech product identified for use in automotive applications are qualified and meet AEC Q100 standard. Product in this column with a "NO" indicate that this automotive part number is still undergoing qualification. Product in this column with a "N/A" indicate that this part number is not rated for automotive applications. [top]

Note (15)

Semtech automotive product identified have PPAP, Production Part Approval Process, a method, instructions for setting up the approval process of the parts intended for the production. It is used primarily in the automotive industry. Semtech Corporation follows TS16949 guidenance for PPAP packages at Level 2 minimum. [top]

Note (16)

Semtech Automotive product identified has been posted on IMDS, International Material Data System. IMDS is a global data repository that contains information on materials used by the automotive industry. In IMDS, Semtech automotive product is listed with all materials present and are collected, maintained, analyzed and archived. Semtech product listed in IMDS meets the obligations placed on suppliers of automotive rated product by national and international standards, laws and regulations. [top]

Note (17)

Packaging material applies to shipped material such as pizza boxes, tube boxes, moisture barrier bags, dessicants, reels, wafer packs, trays, binding straps, and carrier boxes. Packaging material is compliant to directive 94/62/EC as recycleable and reuseable material. [top]

Disclaimer

The information provided on this page represents Semtech's knowledge and belief as of the date that it was provided. Semtech has relied on information provided by our suppliers and has taken, and continues to take, commercially resonable steps to provide representative and accurate information. Semtech's standard Sales Terms and Conditions, including warranty and limitations of liability, apply to the declarations made herein unless otherwise provided by a written contract or other agreement signed by the parties. [top]

 

 

 

Contact Information:
Semtech Corporation
200 Flynn Road
Camarillo, CA 93012
(805) 498-2111
Compliance Manager:
Pat Sanchez
Corporate Quality
Semtech Corporation
psanchez@semtech.com
RiskManagement@semtech.com
conflictfree@semtech.com
RoHSCompliance@semtech.com